For the second year in a row, Forbes named us one of the best employers for diversity. This milestone highlights our commitment to fostering a culture of diversity and inclusion—uncover career opportunities at Lam.
Honesty, integrity, accountability, respect, and trust underpin everything we do at Lam, and we are grateful to be recognized by Ethisphere as one of the 2024 World's Most Ethical Companies. Read more on the blog.
Being the only person of color in a classroom or workplace can feel isolating, but Senior Product Engineer Theron Smith doesn’t let that discourage him. Learn more about why Theron is so motivated to increase diversity in STEM fields and how a career at Lam allows him to do so.
Optically based measurement technologies face challenges as chip manufacturers begin adopting scaling approaches that stack components vertically. The solution? Our mass metrology tool Metior® is capable of measuring thick film stacks, high aspect ratios, and buried etched features. Explore the advantages and applications on the blog.
We earned a spot on CNBC and JUST Capital's 2024 list of America's Most JUST Companies, coming in at #6 out of 34 semiconductor companies and #32 out of the 937 companies overall. The ranking reveals which companies do the best job at creating value for their stakeholders while prioritizing sustainability, customer privacy, employee benefits, and more. Learn more.
Precision is paramount in the world of chip design, and traditional 2D design rule checking (DRC) can fall short when it comes to catching potential hot spots at advanced nodes. Fortunately, the SEMulator3D® virtual fabrication platform speeds up the development process, helps engineers identify possible chip failures, and reduces reliance on costly silicon wafer-based experiments. The blog covers the details.
Fortune named us to its 2024 World's Most Admired Companies list, based on a survey of companies spanning 29 countries and 53 industries.
New metals, specifically barrierless ruthenium, are being considered as a possible replacement for copper as interconnect dimensions shrink. Read more about Ru (ruthenium) and its ability to satisfy electromagnetic reliability requirements with much lower RC delay.
